PLATING MATERIAL, AND TERMINAL-EQUIPPED ELECTRIC WIRE, CONNECTOR, AND WIRE HARNESS USING THE SAME

A plating material includes a metal base material and a silver-tin alloy plating layer being arranged on the metal base material and containing a silver-tin alloy. Further, the silver-tin alloy plating layer contains crystal grains of Ag3Sn, and a ratio of grains of Sn per observed area is equal to...

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Bibliographische Detailangaben
Hauptverfasser:	NAKATSUKA, Dai, ISHII, Takuma, TAMURA, Nobuyuki
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A plating material includes a metal base material and a silver-tin alloy plating layer being arranged on the metal base material and containing a silver-tin alloy. Further, the silver-tin alloy plating layer contains crystal grains of Ag3Sn, and a ratio of grains of Sn per observed area is equal to or greater than 2.0% and equal to or less than 11.0% when the crystal grains of Ag3Sn are arranged isotropically, and a cross-section of the silver-tin alloy plating layer is observed with an FE-SEM.