ULTRASONIC DEVICE AND METHOD OF FORMING THE SAME, ULTRASONIC ASSEMBLIES AND METHODS OF FORMING THE SAME

An ultrasonic device is provided. The ultrasonic device includes at least one micromachined ultrasonic transducer (MUT) and processing circuitry electrically coupled to the at least one MUT. The at least one MUT and the processing circuitry are packed in an embedded wafer level ball grid array (eWLB...

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Bibliographische Detailangaben
Hauptverfasser:	OBERMEIER, Daniel, ELIAN, Klaus, STOICESCU, Emanuel
Format:	Patent
Sprache:	eng
Schlagworte:	FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	An ultrasonic device is provided. The ultrasonic device includes at least one micromachined ultrasonic transducer (MUT) and processing circuitry electrically coupled to the at least one MUT. The at least one MUT and the processing circuitry are packed in an embedded wafer level ball grid array (eWLB) package. An acoustic coupling medium for acoustic coupling of the at least one MUT to an external application surface is formed on the at least one MUT.