INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES

Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Canham, Rick, Smalley, Jeffory L, Ferguson, Shelby Ann, Klein, Steven Adam
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.