WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF

WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF

A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KATSUMATA, Masaaki, KAWAMATA, Takashi, MINATO, Eiko, HOSOKAWA, Atsushi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.