SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YANNOU, Jean Marc, ESSIG, Kay Stefan, APPELT, Bernd Karl, YEN, You-Lung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.