SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

According to one embodiment, a semiconductor device includes a semiconductor element on a substrate. A first surface of the semiconductor element faces away from the substrate and a second surface faces the substrate. A first surface electrode is on the first surface of the semiconductor element. A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATSUO, Keiichiro, SATO, Katsuya, MINAMI, Shogo, IGUCHI, Tomohiro
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, a semiconductor device includes a semiconductor element on a substrate. A first surface of the semiconductor element faces away from the substrate and a second surface faces the substrate. A first surface electrode is on the first surface of the semiconductor element. A bonding wire is connected to the first surface electrode at a bonding portion. A first sealing member covers the bonding portion. A second sealing member covers a portion of the first surface electrode outside the bonding portion. A third sealing member covers the first sealing member and the second sealing member.