SYSTEMS AND METHODS FOR ADAPTIVE TROUBLESHOOTING OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

A system includes a processing device, operatively coupled to the memory device, to perform operations comprising obtaining a plurality of sensor values associated with a deposition process performed, according to a recipe, in a process chamber to deposit film on a surface of a substrate. A machine-learning model is applied to the plurality of sensor values. The machine-learning model is trained based on historical sensor data of a sub-system of the process chamber and task data associated with the recipe for depositing the film. An output of the machine-learning model is generated that is indicative of a suspected failure of the sub-system and a corrective action is generated based on the suspected failure of the sub-system.