TECHNIQUES FOR GRATING COUPLER AND EDGE COUPLER INTEGRATION

Some embodiments relate to an integrated chip (IC) including a handle substrate; a semiconductor layer comprising a grating coupler region and an edge coupler region; an insulative layer between the handle substrate and the semiconductor layer; a grating coupler in the grating coupler region comprising a plurality of trenches arranged in the semiconductor layer; and an edge coupler in the edge coupler region of the semiconductor layer including: a base structure having an end proximate to an edge of the insulative layer, and tapered sidewalls extending laterally from the end; and an upper structure extending over the base structure, the upper structure having an end proximate to the edge of the insulative layer, and tapered sidewalls extending laterally from the end between the tapered sidewalls of the base structure; where the handle substrate continuously extends from directly beneath the plurality of trenches to directly beneath the upper structure.