CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample o...

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Bibliographische Detailangaben
Hauptverfasser:	DING, Ding, MA, Xiangguo, DENG, Lin, LIU, Zhukai
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet is in one or both of the first cover plate and the second cover plate, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.