THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDUCTIVE LAYER OVER A CIRCUIT BOARD

THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDUCTIVE LAYER OVER A CIRCUIT BOARD

A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Grolle, Steven Nicholas, Kailkhura, Gargi, Ingalz, Charles, Bannick, Stephen Robert, Diao, Andrew, How, Peter H.J
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.