ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME

A semiconductor device includes a device wafer including a first side and a second side opposite to each other, and a carrier wafer disposed over the first side of the device wafer. The carrier wafer includes an electrostatic discharge (ESD) protection circuit. The ESD protection circuit includes a...

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Bibliographische Detailangaben
Hauptverfasser:	Hung, Tao-Yi, Lee, Jam-Wem, Chen, Kuo-Ji, Lin, Wun-Jie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device includes a device wafer including a first side and a second side opposite to each other, and a carrier wafer disposed over the first side of the device wafer. The carrier wafer includes an electrostatic discharge (ESD) protection circuit. The ESD protection circuit includes a first diode and a second diode. The first diode is operatively coupled to a first power rail, and the second diode is operatively coupled to a second power rail at least through the device wafer.