METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY

Disclosed is a method of manufacturing a fan-out packaging device using wafer or panel level packaging including forming a base metal layer on a partial area of a fan-out packaging substrate, forming a first dielectric layer on the base metal layer, patterning the first dielectric layer to form a vi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SUTARDJA, Sehat
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed is a method of manufacturing a fan-out packaging device using wafer or panel level packaging including forming a base metal layer on a partial area of a fan-out packaging substrate, forming a first dielectric layer on the base metal layer, patterning the first dielectric layer to form a via hole, forming a redistribution layer (RDL) on the first dielectric layer and the via hole, forming a second dielectric layer on the redistribution layer (RDL), and patterning the second dielectric layer to form a bump structure connected to the redistribution layer.