MICROLED DEFECT MANAGEMENT

The present invention discloses a method to manage defects in microdevice sets being transferred from a donor substrate to a system or temporary substrate. Various methods can identify the defects before and after the transfer, and rectifying mechanisms or steps are outlined. A key point is to adjus...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHAJI, Gholamreza, SIBONI, Hossein Zamani
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention discloses a method to manage defects in microdevice sets being transferred from a donor substrate to a system or temporary substrate. Various methods can identify the defects before and after the transfer, and rectifying mechanisms or steps are outlined. A key point is to adjust the transfer of a next set of microdevices based on data on defects.