LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD

A liquid ejection head includes a recording element substrate configured to eject a liquid, a supporting member configured to support the recording element substrate and including a supply channel configured to supply a liquid to the recording element substrate, and a channel member configured to su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IMAMURA, ISAO, TSUTSUI, SATOSHI, YAMAJI, HARUKA, KIHARA, HIROKI
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
CORRECTION OF TYPOGRAPHICAL ERRORS
DYES
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:A liquid ejection head includes a recording element substrate configured to eject a liquid, a supporting member configured to support the recording element substrate and including a supply channel configured to supply a liquid to the recording element substrate, and a channel member configured to supply a liquid to the supply channel, wherein at least one bonding surface between two of the recording element substrate, the supporting member, and the channel member is made of an epoxy resin composition containing an epoxy resin mixture and a powder curing agent, the epoxy resin mixture contains an epoxy resin that is liquid at normal temperature and a coumarone resin that is dissolvable in the epoxy resin, a weight average molecular weight of the epoxy resin mixture is 300 or more and 600 or less, and the liquid ejection head contains a cured substance of an adhesive agent containing the epoxy resin composition.