PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE

A processing method for a workpiece includes applying to the workpiece a pulsed laser beam that causes ablation to thereby generate plasma light and generate a first distribution pattern, the beam having a wavelength and intensity of light intrinsic to the workpiece substance, the beam being used to...

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Bibliographische Detailangaben
Hauptverfasser:	HIROSE, Tsubasa, MORIKAZU, Hiroshi
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A processing method for a workpiece includes applying to the workpiece a pulsed laser beam that causes ablation to thereby generate plasma light and generate a first distribution pattern, the beam having a wavelength and intensity of light intrinsic to the workpiece substance, the beam being used to find and set appropriate processing conditions for processing the workpiece; recording the first distribution pattern and the processing conditions in a linked manner; applying the beam to the workpiece to generate plasma light; generating a second distribution pattern including a wavelength and intensity of light intrinsic to the workpiece substance, according to the plasma light; collating the second distribution pattern and the first distribution pattern to thereby select a third distribution pattern having a degree of similarity in a predetermined range; and processing the workpiece in reference to processing conditions linked to the third distribution pattern.