INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS

Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece having an interconnect structure that includes a first conductive feature, a second conductive feature dis...

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Bibliographische Detailangaben

Hauptverfasser:	Chen, Hsin-Ping, Su, Li-Lin, Yang, Tai-I, Wu, Yung-Hsu, Chuang, Cheng-Chi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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