PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition including: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; and (C) a photopolymerizable compound, in which the photopolymerizable...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA, Naoki, OYAMA, Yasuyuki, YAMAKAWA, Arisa, YAMAGUCHI, Kaho, SAWAMOTO, Hayato
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition including: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; and (C) a photopolymerizable compound, in which the photopolymerizable compound includes a photopolymerizable compound having four or more ethylenically unsaturated groups and a photopolymerizable compound having three or fewer ethylenically unsaturated groups.