ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING THE ELECTRONICS ARRANGEMENT

An electronics arrangement contains a printed circuit board (PCB), a semiconductor device and a heat sink. A first side of the semiconductor device points toward the PCB and a second side, opposite the first side, bears the heat sink, which is thermally connected to the semiconductor device. A fan i...

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Bibliographische Detailangaben
Hauptverfasser:	Müller, Nina, Eisner, Matthias
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronics arrangement contains a printed circuit board (PCB), a semiconductor device and a heat sink. A first side of the semiconductor device points toward the PCB and a second side, opposite the first side, bears the heat sink, which is thermally connected to the semiconductor device. A fan is provided for producing an airflow flowing around the heat sink. An air guide device is mounted on the PCB and is configured such that, together with the PCB, it forms an air duct having an air duct inlet and an air duct outlet. The airflow flowing into the air duct flows through the air duct inlet and leaves through the air duct outlet. The air guide device has an air guide ramp that is arranged in the area of the air duct inlet such that the airflow flowing into the air duct inlet is deflected toward the heat sink.