INSULATING CHIP AND SIGNAL PROPAGATING DEVICE

INSULATING CHIP AND SIGNAL PROPAGATING DEVICE

An insulating chip includes a substrate; an element insulating layer which is disposed on the substrate, and a capacitor which is embedded in the element insulating layer and which includes a first electrode plate and a second electrode plate. The first electrode plate and the second electrode plate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TANAKA, Bungo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An insulating chip includes a substrate; an element insulating layer which is disposed on the substrate, and a capacitor which is embedded in the element insulating layer and which includes a first electrode plate and a second electrode plate. The first electrode plate and the second electrode plate are disposed face to face in a first direction that is orthogonal to the thickness direction of the element insulating layer. A signal propagating device includes the insulating chip.