PACKAGE STRUCTURE WITH REINFORCING STRUCTURES

PACKAGE STRUCTURE WITH REINFORCING STRUCTURES

A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a reinforcing structure over the circuit substrate. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN, Po-Yao, YEW, Ming-Chih, LAI, Po-Chen, LIN, Yu-Sheng, JENG, Shin-Puu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a reinforcing structure over the circuit substrate. The reinforcing structure partially surrounds a corner of the die package. The package structure further includes an underfill structure surrounding the bonding structure. The underfill structure wraps around an end of the reinforcing structure. In a top view of the package structure, the reinforcing structure has an outer corner, and the underfill structure is spaced apart from the outer corner of the reinforcing structure.