LEAD FRAME AND SEMICONDUCTOR DEVICE

LEAD FRAME AND SEMICONDUCTOR DEVICE

A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SONEHARA, Kesayuki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SONEHARA, Kesayuki
description A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved part is curved toward the upper surface of the die pad at the groove.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024332140A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024332140A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024332140A13</originalsourceid><addsrcrecordid>eNrjZFD2cXV0UXALcvR1VXD0c1EIdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGxkaGJgaOhsbEqQIAwaIjSw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD FRAME AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>SONEHARA, Kesayuki</creator><creatorcontrib>SONEHARA, Kesayuki</creatorcontrib><description>A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved part is curved toward the upper surface of the die pad at the groove.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024332140A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241003&amp;DB=EPODOC&amp;CC=US&amp;NR=2024332140A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONEHARA, Kesayuki</creatorcontrib><title>LEAD FRAME AND SEMICONDUCTOR DEVICE</title><description>A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved part is curved toward the upper surface of the die pad at the groove.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD2cXV0UXALcvR1VXD0c1EIdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGxkaGJgaOhsbEqQIAwaIjSw</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>SONEHARA, Kesayuki</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>LEAD FRAME AND SEMICONDUCTOR DEVICE</title><author>SONEHARA, Kesayuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024332140A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SONEHARA, Kesayuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONEHARA, Kesayuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD FRAME AND SEMICONDUCTOR DEVICE</title><date>2024-10-03</date><risdate>2024</risdate><abstract>A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved part is curved toward the upper surface of the die pad at the groove.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024332140A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEAD FRAME AND SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T11%3A42%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SONEHARA,%20Kesayuki&rft.date=2024-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024332140A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true