LEAD FRAME AND SEMICONDUCTOR DEVICE

LEAD FRAME AND SEMICONDUCTOR DEVICE

A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SONEHARA, Kesayuki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A lead frame includes a die pad having an upper surface and a lower surface, and a curved part disposed outside the die pad in a bottom view, and having one end connected to an outer edge of the die pad. The curved part has a groove that opens toward the lower surface of the die pad, and the curved part is curved toward the upper surface of the die pad at the groove.