CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMPROVED WARPAGE CONTROL

A carrier assembly comprises a carrier main body comprising a housing, the housing comprising side walls having supporting slots for carrying the semiconductor package strips inside the housing, respectively, and the housing defining a front opening and a rear opening between the side walls to allow for placement and displacement of the semiconductor package strips, and a pair of clamping devices for applying clamping forces to the semiconductor package strips against the supporting slots, respectively, and each of the pair of clamping device comprising a locking plate, strip contacting extensions extending from the locking plate and insertable through one of the front opening and the rear opening of the housing, and a locking member for moving the strip contacting extensions between a locked position and an unlocked position, wherein in the locked position the substrate package strips are pressed against the supporting slots by the respective strip contacting extensions.