METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT

Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semico...

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Bibliographische Detailangaben
Hauptverfasser:	Nunez Blanco, Ruben Eduardo, Yost, Craig, Diglio, Paul Jonathan
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CYLINDERS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PISTONS PRINTED CIRCUITS SEALINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.