Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives

The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or a...

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Bibliographische Detailangaben
Hauptverfasser:	Lal, Gauri Sankar, Hartmann, John, Roumpelakis, Emmanouil, Fazel, Shafiq, La Comare, Douglas M
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or at least one additional excipient. Methods of making and use are further provided.