IMPLANTABLE MEDICAL DEVICE WITH FLEX CIRCUIT

Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to t...

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Bibliographische Detailangaben
1. Verfasser: English, James Michael
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to the printed circuit board assembly. The flex circuit is then secured to the first portion of encapsulant, prior to applying a second portion of encapsulant.