IMPLANTABLE MEDICAL DEVICE WITH FLEX CIRCUIT
Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to t...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to the printed circuit board assembly. The flex circuit is then secured to the first portion of encapsulant, prior to applying a second portion of encapsulant. |
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