SEMICONDUCTOR PACKAGE

A semiconductor package includes a first redistribution structure including a first redistribution insulating layer and a first redistribution pattern, a first lower semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first lower semiconductor device on the first redistribution structure, a plurality of vertical connection conductors in the molding layer and electrically connected to the first redistribution pattern, a heat dissipation plate disposed on an upper surface of the first lower semiconductor device, and a plurality of upper semiconductor devices disposed on the molding layer and on the first lower semiconductor device, each of the plurality of upper semiconductor devices vertically overlapping a different respective region of the first lower semiconductor device.