BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING BONDED BODY

To suppress a decrease of strength, a bonding paste includes a copper particle, a solvent, and an additive composed of a phosphate ester. In the bonding paste, a content of the additive is in the range of 0.5% to 3.0% by mass both inclusive relative to a total of the bonding paste.

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Bibliographische Detailangaben
Hauptverfasser:	Yamaguchi, Tomohiko, Nakaya, Kiyotaka, Iwata, Koutarou
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	To suppress a decrease of strength, a bonding paste includes a copper particle, a solvent, and an additive composed of a phosphate ester. In the bonding paste, a content of the additive is in the range of 0.5% to 3.0% by mass both inclusive relative to a total of the bonding paste.