PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE

The photosensitive resin composition of the present invention includes a polymer A having a structural unit represented by General Formula (a) and a polymer B including a polyimide having a group b represented by General Formula (b).

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Bibliographische Detailangaben
Hauptverfasser:	Kuboyama, Toshiharu, Imai, Keita, Ueda, Yuki, Otoguro, Akihiko
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The photosensitive resin composition of the present invention includes a polymer A having a structural unit represented by General Formula (a) and a polymer B including a polyimide having a group b represented by General Formula (b).