SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Provided is a semiconductor chip including a substrate, an active layer on the substrate, and a coated layer on side surfaces of the active layer and configured to surround the active layer, wherein an average roughness of the side surfaces of the active layer is greater than an average roughness of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, Jimin, HAN, Manhee
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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