SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Provided is a semiconductor chip including a substrate, an active layer on the substrate, and a coated layer on side surfaces of the active layer and configured to surround the active layer, wherein an average roughness of the side surfaces of the active layer is greater than an average roughness of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Jimin, HAN, Manhee
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is a semiconductor chip including a substrate, an active layer on the substrate, and a coated layer on side surfaces of the active layer and configured to surround the active layer, wherein an average roughness of the side surfaces of the active layer is greater than an average roughness of an upper surface of the active layer, and at least a portion of the substrate contacts the coated layer.