ELECTRONIC DEVICE COMPRISING A SINGLE DIELECTRIC LAYER FOR SOLDER MASK AND CAVITY AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE COMPRISING A SINGLE DIELECTRIC LAYER FOR SOLDER MASK AND CAVITY AND METHOD FOR FABRICATING THE SAME

Systems and methods of the present disclosure are directed to an electronic substrate. The electronic substrate includes a base layer, first feature(s) formed from a first metal layer and a second metal layer, and second feature(s) formed from the first metal layer. The electronic substrate includes...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Orlowski, John August, Morris, Thomas Scott
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Systems and methods of the present disclosure are directed to an electronic substrate. The electronic substrate includes a base layer, first feature(s) formed from a first metal layer and a second metal layer, and second feature(s) formed from the first metal layer. The electronic substrate includes a polymerized photodielectric layer over the first feature(s) and the second feature(s). The polymerized photodielectric layer exposes a portion of the second metal layer of the first feature(s), and at least a portion of the first metal layer of the second feature(s).