Techniques For Transferring Heat From Electronic Devices Using Heatsinks

An electronic device includes a first layer and a thermal heatsink that comprises a conductive region in a second layer of the electronic device. The thermal heatsink further comprises a first via that extends through the first layer. The first via is filled with conductive material that is coupled...

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Bibliographische Detailangaben
Hauptverfasser:	Nalamalpu, Ankireddy, Chakraborty, Ritochit, Maheshwari, Atul, Hossain, Md Altaf, Kumashikar, Mahesh, Kolluru, Krishna Bharath
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic device includes a first layer and a thermal heatsink that comprises a conductive region in a second layer of the electronic device. The thermal heatsink further comprises a first via that extends through the first layer. The first via is filled with conductive material that is coupled to the conductive region. The conductive material in the first via is coupled to an external terminal of the electronic device. The electronic device can also include a second via filled with conductive material that is coupled to the conductive region.