SEMICONDUCTOR DEVICE

A semiconductor device includes: a semiconductor chip; a bonding wire electrically connected to an electrode provided on the semiconductor chip; and a connecting substrate jointed to the electrode of the semiconductor chip, in which: a thermal expansion coefficient of the connecting substrate is equ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANAI, Naoyuki, HINATA, Yuichiro
Format: Patent
Sprache:eng
Schlagworte:
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