SEMICONDUCTOR DEVICE

A semiconductor device includes: a semiconductor chip; a bonding wire electrically connected to an electrode provided on the semiconductor chip; and a connecting substrate jointed to the electrode of the semiconductor chip, in which: a thermal expansion coefficient of the connecting substrate is equal to a thermal expansion coefficient of the bonding wire, or the thermal expansion coefficient of the connecting substrate is within a range of the thermal expansion coefficient of the bonding wire or less and a first thermal expansion coefficient or greater, a difference between the first thermal expansion coefficient and the thermal expansion coefficient of the bonding wire is a predetermined value, and the bonding wire is jointed to the connecting substrate to be electrically connected to the electrode via the connecting substrate.