VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

Embodiments herein relate to systems, apparatuses, techniques and/or processes for creating a substrate out of a plurality of layers of glass, where the substrate includes one or more vias that extend through each of the plurality of layers of glass. In embodiments, a high aspect ratio via may be co...

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Bibliographische Detailangaben
Hauptverfasser: AHMED, Numair, NAD, Suddhasattwa, DUAN, Gang, DUONG, Benjamin, GRUJICIC, Darko, KANDANUR, Sashi S, PIETAMBARAM, Srinivas V, RAHMAN, Mohammad Mamunur, MARIN, Brandon C
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments herein relate to systems, apparatuses, techniques and/or processes for creating a substrate out of a plurality of layers of glass, where the substrate includes one or more vias that extend through each of the plurality of layers of glass. In embodiments, a high aspect ratio via may be constructed through the substrate by electrically coupling the individual vias. Other embodiments may be described and/or claimed.