ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT PACKAGE

An electronic component package includes an electronic component and a sealing resin sealing the electronic component. In the electronic component package, one of main surfaces of the sealing resin defines a mounting surface used for mounting the electronic component package on a different substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHIMORI, Hiroki, NAKAGOSHI, Hideo, TAKAKURA, Tsuyoshi, NAKAMURA, Takamitsu, KINO, Daisuke
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic component package includes an electronic component and a sealing resin sealing the electronic component. In the electronic component package, one of main surfaces of the sealing resin defines a mounting surface used for mounting the electronic component package on a different substrate, and in a view of the mounting surface of the sealing resin, a land electrically connected to an electrode of an electronic component and a conductor made of solder or an alloy phase between the solder and another metal and surrounding at least a portion of an outer circumference of the land are exposed on the mounting surface.