MEASUREMENT METHOD AND APPARATUS FOR SEMICONDUCTOR FEATURES WITH INCREASED THROUGHPUT

MEASUREMENT METHOD AND APPARATUS FOR SEMICONDUCTOR FEATURES WITH INCREASED THROUGHPUT

A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput include using a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for training the modified machine lea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Buxbaum, Alex, Klochkov, Dmitry, Malki, Oliver, Avishai, Amir, Korb, Thomas, Neumann, Jens Timo, Foca, Eugen, Persch, Johannes, Freytag, Alexander
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput include using a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for training the modified machine learning algorithm includes reducing a user interaction. The method can be more flexible and robust and can involve less user interaction than conventional methods. The system and method can be used for quantitative metrology of integrated circuits within semiconductor wafers.