METHOD OF COOLING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE COOLING SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

There is provided a technique that includes: transferring a substrate from a process chamber to a transfer chamber, after processing the substrate disposed at the process chamber while detecting a temperature by a temperature sensor installed at a substrate support configured to support the substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI, Hideto, SUGISHITA, Masashi
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	There is provided a technique that includes: transferring a substrate from a process chamber to a transfer chamber, after processing the substrate disposed at the process chamber while detecting a temperature by a temperature sensor installed at a substrate support configured to support the substrate; and cooling the substrate so that the temperature detected by the temperature sensor becomes equal to or lower than a set temperature while the substrate support is located at a predetermined position.