INTEGRATED CIRCUIT DEVICE

Provided is an integrated circuit device including a plurality of fin-type active areas each extending on a substrate in a first horizontal direction, a plurality of gate structures each extending in a second horizontal direction intersecting the plurality of fin-type active areas on the substrate and spaced apart from each other in the first horizontal direction, an interlayer insulating layer covering the periphery of the plurality of gate structures, and an inter-gate cutting layer formed of an insulating material and extending in the first horizontal direction across through the plurality of gate structures and the interlayer insulating layer. A first gate structure is separated from a second gate structure by the inter-gate cutting layer, and portions of respective side surfaces of the gate structures overlap the plurality of fin-type active areas in a vertical direction, the respective side surfaces of the gate structures extending in the first horizontal direction.