METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING A WAFER INSPECTION APPARATUS

A method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes a first step of loading a first wafer including a plurality of semiconductor chips having the same pattern on a stage of a wafer inspection apparatus, a second step of inspecting...

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Bibliographische Detailangaben

Hauptverfasser:	KIM, Ki Hun, HA, Jeong-Su, KIM, Jhong Kwon, JEON, Yong Ju, MYOUNG, Da Young
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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