METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING A WAFER INSPECTION APPARATUS

A method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes a first step of loading a first wafer including a plurality of semiconductor chips having the same pattern on a stage of a wafer inspection apparatus, a second step of inspecting the plurality of semiconductor chips using light having different wavelengths from each other, and a third step of unloading the first wafer from the stage of the wafer inspection apparatus, wherein inspecting of the plurality of semiconductor chips using the light includes inspecting patterns at the same first positions of the respective semiconductor chips, inspecting patterns at the same second positions of the respective semiconductor chips, inspecting patterns at the same k-th positions of the respective semiconductor chips, and determining the semiconductor chip having a pattern defect by combining pattern inspection results at each of the first to k-th positions.