CURABLE HOTMELT SILICONE COMPOSITION, ENCAPSULANT, HOTMELT ADHESIVES, AND OPTICAL SEMICONDUCTOR DEVICE

A curable hot-melt silicone composition, comprising, (A) a resinous alkenyl group-containing organopolysiloxane that includes at least two alkenyl groups and at least one aryl group per molecule, (B) a curable linear organopolysiloxane that includes at least one aryl group per molecule, (C) a curabl...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEUCHI, Shunya, IGUCHI, Yuri
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A curable hot-melt silicone composition, comprising, (A) a resinous alkenyl group-containing organopolysiloxane that includes at least two alkenyl groups and at least one aryl group per molecule, (B) a curable linear organopolysiloxane that includes at least one aryl group per molecule, (C) a curable linear or branched organopolysiloxane that includes at least one aryl group per molecule, where the aryl group content is 40 mol % or more for (A), (B), and (C), (D) a silicone reactive compatibilizer having a weight-average molecular weight of 1000 or less, that is selected from: (D-1) cyclic organopolysiloxanes; (D-2) MQ resins; and (D-3) organopolysiloxanes different from component (A), that include at least one (ArSiO3/2) unit per molecule or that have an aryl group content of 20 mol % or less, (E) an organohydrogenpolysiloxane having at least 2 silicon atom-bonded hydrogen atoms per molecule, that is different from component (D), and (F) a curing catalyst.