SOLDERING APPARATUS AND SOLDERING METHOD USING SAME

A soldering apparatus and a soldering method using the same are provided. The soldering apparatus includes a light source configured to supply light radiation required for soldering; and a mask disposed on the light path of the light source and including a light-shielding portion and multiple light-...

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Bibliographische Detailangaben
Hauptverfasser:	SUN, Ming, LU, Jingquan, ZHUANG, Wenrong
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A soldering apparatus and a soldering method using the same are provided. The soldering apparatus includes a light source configured to supply light radiation required for soldering; and a mask disposed on the light path of the light source and including a light-shielding portion and multiple light-transmissive portions. The multiple light-transmissive portions are spaced apart by the light-shielding portion and are configured for the light radiation to pass through. The mask has different transmittances so that the magnitude of the light power irradiated on a substrate can be controlled. Therefore, devices can not only be soldered in batches but also be prevented from being damaged caused by inconsistent requirements on light powers.