Flexible printed circuit
The present disclosure discloses a circuit board including a substrate layer, a line layer fixed to the substrate layer and two protective layers wrapped on both sides of the substrate layer to cover the line layer, wherein, the line layer is embedded in the substrate layer and the surface of the li...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present disclosure discloses a circuit board including a substrate layer, a line layer fixed to the substrate layer and two protective layers wrapped on both sides of the substrate layer to cover the line layer, wherein, the line layer is embedded in the substrate layer and the surface of the line layer is flush with the surface of the substrate layer. The surface of the flexible circuit board is neat and can be easily bonded to other components, and during processing, because the surface of the line layer and the substrate layer are flush, when the protective layer is laminated to the substrate layer, there is no gap between the protective layer and the substrate layer, and the protective layer and the line layer, so there are no cavity bubbles between the line layer and the protective layer, and it has a high thermal reliability level. |
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