HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surf...

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Bibliographische Detailangaben
Hauptverfasser:	ARIMA, Keisuke, SATO, Tomoaki, KANI, Hiroyuki
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surface of the mounting board on which the power amplifier is disposed. The resin layer is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board. A groove portion is formed in the resin layer. The groove portion includes a bottom portion positioned between a third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board.