SEMICONDUCTOR DEVICE INCLUDING EXTENDED BACKSIDE CONTACT STRUCTURE

Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1st portion which is not vertically overlapped by the circui...

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Bibliographische Detailangaben
Hauptverfasser: PARK, Panjae, SEO, Kang-ill, SONG, Seung Min
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1st portion which is not vertically overlapped by the circuit element.