PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE PACKAGING STRUCTURE

A packaging structure includes a first transparent substrate including includes a first surface and a second surface, a second transparent substrate including a third surface facing the second surface, a support connecting the second surface and the third surface, an optical lens assembly on the third surface, a packaging assembly including includes a base on the first surface and electrodes, and an optical component. The second transparent substrate and the first transparent substrate are stacked in a first direction. A first cavity is defined by the support connecting the second transparent substrate and the first transparent substrate. A second cavity is defined by the base and the first transparent substrate. The optical component is received in the second cavity. The optical component and the optical lens assembly overlap in the first direction, the optical component is electrically connected to the electrodes and located between the first surface and the electrodes.