SEMICONDUCTOR DEVICE

A semiconductor device includes a first die having a first and second physical layer regions adjacent each other, connecting pads and a connecting wire on a lower surface of the first die, a rear wiring layer having a first rear wire on the first die, and through silicon vias penetrating the first d...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yu, Bongwee, Huh, Junho
Format: Patent
Sprache:eng
Schlagworte:
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