SEMICONDUCTOR DEVICE

A semiconductor device includes a first die having a first and second physical layer regions adjacent each other, connecting pads and a connecting wire on a lower surface of the first die, a rear wiring layer having a first rear wire on the first die, and through silicon vias penetrating the first die, the through silicon vias including a first and second through silicon vias. The connecting pads include a first and a second connecting pads electrically connected with the first and second physical layer regions respectively, and a first and a second pads electrically connected with the first and second through silicon vias respectively. The first rear wire is electrically connected with the first and second through silicon vias. The connecting wire is electrically connected with the first connecting pad and the first pad.